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Feb 4, 2019  Irvine, CA

Materials Offer Unique Combination of High Thermal Conductivity and Low Assembly Stress

Henkel Expands BERGQUIST® GAP PAD® Portfolio with New Ultra-Low Modulus Thermal Interface Materials

Henkel Corporation today announced the addition of two ultra-low modulus BERGQUIST® GAP PAD® thermal interface materials (TIMs) to its award-winning line of high compliance thermal management products.  BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM have been formulated with an advanced resin platform to deliver ultra-low modulus capabilities and high thermal conductivity of 6.0 W/m-K and 7.0 W/m-K, respectively.  

“As densities increase with electronics miniaturization, maximizing heat dissipation while minimizing assembly stress on delicate components is challenging but essential for reliability,” says Danny Leong, Henkel Global Technology Manager, Thermal Products.  “Our new ultra-low modulus TIMs provide this unique performance combination in custom-sized pads with easy handling to enhance process efficiency.”

BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM are very soft pads with high conformability to rough or irregular surfaces, effectively filling intricate gaps and allowing for thorough wet out at the interface for maximum thermal transfer.  Historically, marrying ultra-low modulus (Shore 000, ASTM D2240) properties with high thermal conductivity has been challenging at best.  However, due to the advanced silicone-based resin formulation and filler package, the new BERGQUIST GAP PADs provide exceptionally low assembly stress alongside high thermal control.  

Ideal for telecom and datacom applications such as high-end routers, switches, servers and base band units, the ultra-low modulus TIMs also deliver on manufacturers’ processability requirements.  Easy-to-use, BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM are naturally tacky on both sides.  BERGQUIST GAP PAD TGP 6000ULM integrates fiberglass support with one side offering minimal tack for simple handling and rework.  BERGQUIST GAP PAD TGP 7000ULM is supplied without fiberglass support and similar tackiness levels on both sides of the pad. Available in custom-cut shapes and sizes with top- and bottom-side protective liners, the ultra-low modulus BERGQUIST GAP PADs are ready for immediate use upon receipt and can be stored at room temperature.  

Samples of the new BERGQUIST GAP PADs are available upon request.  For more information about the latest materials or any of Henkel’s thermal management solutions, visit henkel-adhesives.com/thermal or call 1-800-347-4572.