High Thermal, Semi-Sintering Die Attach Paste a Breakthrough for Emerging Package Performance Requirements
Henkel has developed and commercialized a novel series of die attach materials to facilitate package-level sintering, addressing the regulatory challenges of high-lead solders, thermal conductivity drawbacks of conventional die attach pastes, and processability shortcomings of traditional sintering products. The patent-pending LOCTITE® ABLESTIK® ABP 8068T portfolio includes high thermal, semi-sintering die attach pastes that offer simplified processing, and best-in-class thermal and electrical performance with robust reliability for today’s high power density devices.
