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ERGQUIST® GAP PAD® TGP 10000ULM combines high thermal conductivity and an ultra-low modulus for the ultimate in thermal performance.

Feb 13, 2020 Press Release

Henkel Expands Line of High Thermal Conductivity BERGQUIST® GAP PADs® for High Power Applications

Henkel today announced the expansion of its award-winning thermal interface materials ‏(TIMs) portfolio with the addition of a product developed to address the high power density challenges associated with new 5G telecom infrastructure and consumer mobility designs. BERGQUIST® GAP PAD® TGP 10000ULM is a formulation that provides exceptionally high thermal conductivity of 10.0 W/m-K within an ultra-low modulus, low assembly stress formulation. The combination of these characteristics makes the material one of the highest performing TIMs available in the market today.

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