Henkel Tackles Challenging 5G, Power, Automotive and Aerospace Applications at IPC APEX EXPO 2020
At next month’s IPC APEX EXPO electronics event in San Diego, CA, Henkel’s exhibit and conference participation will highlight the materials leader’s latest innovations and the scope of its portfolio, which offers ‘solutions across the board’ for multiple applications. Henkel’s aggressive product development initiatives have resulted in advanced thermal management materials for next-generation 5G infrastructure systems, semi-sintering materials that address demanding aerospace reliability requirements, and low voiding solder pastes that help ensure electrical and mechanical reliability for power electronics.
