Feature:
Beyond Adhesives

Student Comes Full Circle at Henkel

Henkel invited masters-level students to compete

Henkel Announces Appointment of Caleb Foltermann as General Manager of Sexy Hair Concepts

Previously VP of Sales for Sexy Hair Concepts at Henkel, Foltermann brings more than 16 years of experience in the beauty professional industry

Henkel reports good development in third quarter

• Sales increase to 5,037 million euros, organic growth +2.7%
• EBIT* improvement: +3.3% to 926 million euros
• EBIT margin* further improved: +40 basis points to 18.4%
• Growth in earnings per preferred share ‏(EPS)*: +2.6% to 1.58 euros

“We must turn off the faucet and continue to monetize waste, so it’s never discarded”

A guest article by David Katz, Founder & CEO of The Plastic Bank

High Operating Temperature Underfill from Henkel Delivers Protection for Aero and Auto Electronics

Anticipating the requirements for next-generation high-reliability electronics applications, Henkel Corporation today announced the development of LOCTITE® ECCOBOND® UF 1173. The protective underfill material, which has been formulated with health and safety top-of-mind, does not contain any reportable REACH SVHCs, is not CMR classified and delivers outstanding performance under high operating temperature environments.

Peelable Thermal Interface Material ‏(TIM) from Henkel Recognized with Industry Accolade

Notching its second notable industry prize, Henkel’s BERGQUIST® Gap Filler TGF 1500RW liquid thermal interface material recently took top honors in the Global Technology Awards’ adhesives/coatings/encapsulants/TIMs category. The award contest, which is sponsored by Global SMT and Packaging magazine, recognizes the best new innovations in the electronics assembly and packaging industries. Henkel Business Development Director, Dr. Mark Currie, accepted the prize during a special ceremony at last month’s Surface Mount Technology International conference.

Henkel awards scholar for research in collaboration with the American Chemical Society

This year’s recipient of the Henkel Award for Outstanding Graduate Research in Polymer Science & Engineering is Aleksandr V. Zhukhovitskiy from the Massachusetts Institute of Technology.

Henkel showcases latest Adhesive Technologies solutions at Semicon Europa

As an event designed to attract visitors from across the European microelectronics landscape, Semicon Europa’s technical focus is uniquely aligned with Henkel’s broad range of semiconductor packaging solutions. The company’s material portfolio including die attach, underfills, and EMI shielding formulations for MEMS, LEDs, RF and power devices, CMOS, and image sensors will be on display at booth A4661 at the European Conference and Exhibition, set to take place from November 13 to 16 in Munich, Germany.