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Sep 14, 2018 Irvine, CA
Henkel Corporation has announced the development of a high performance assembly film designed for applications where extreme reliability is required. The material, LOCTITE® ABLESTIK® CF 3366, is an epoxy-based, silver- filled film adhesive that provides high thermal and electrical conductivity, delivering excellent heat dissipation capabilities for robust thermal management. Leapfrogging other commercial assembly films, the new Henkel material has been designed to address today’s miniaturization trends, increasing power density demands and high operating temperature environments.
“Over the past decade, electronic parts have become smaller, more complex and higher functioning,” says Doug Katze, Global Market Segment Manager Defense & Aerospace for Henkel. “Miniaturization is happening across the board – not only in the well-known consumer and handheld markets, but also in sectors such as aerospace and automotive, pushing the limits of already harsh environments. Our new assembly film accounts for these dynamics, delivering excellent adhesion performance at very high temperature.”
Henkel’s LOCTITE ABLESTIK CF 3366 was formulated to overcome what is a common shortcoming of less thermally capable materials. When tested against another industry film, both LOCTITE ABLESTIK CF 3366 and the alternative film showed good adhesion strength at room temperature. As both materials were subjected to higher operating temperatures, the alternative film lost as much as 75% of its adhesion strength, while LOCTITE ABLESTIK CF 3366 maintained its original adhesion strength up to temperatures as high as 175°C. For applications that encounter extreme conditions, LOCTITE ABLESTIK CF 3366 offers strong adhesion to facilitate reliable RF ground plane performance even during long-term exposure to elevated temperatures.
The new Henkel assembly film has curing capability at temperatures as low as 125°C, providing a void-free bondline with uniform adhesion and controlled thickness. LOCTITE ABLESTIK CF 3366 can be custom cut into highly complex shapes and patterns to accommodate almost any assembly dimension, delivering a precise quantity of adhesive where required. As compared to thermal pastes, assembly films offer a cleaner, more sustainable, low cost-of-ownership, process-friendly solution.
“Henkel’s new assembly film is ideal for high-reliability applications such as aircraft, unmanned aerial vehicles (UAVs), communications, cybersecurity infrastructure, or anywhere assemblies will be exposed to elevated temperature conditions,” concludes Katze. “LOCTITE ABLESTIK CF 3366 offers the performance and peace-of-mind manufacturers of mission-critical applications require.”
For more information, visit henkel-adhesives.com/electronics or call +1-952- 820-6569.