Mar 28, 2018  Irvine, CA

Peelable TIM formulation enables easy assembly rework

New Liquid Gap Filler from Henkel Delivers Thermal Control, Automation and Reworkability

Building on the leading BERGQUIST brand thermal management portfolio, Henkel has developed a brand new liquid gap filler that offers the rare advantage of thermal interface material (TIM) reworkability without sacrifices in thermal conductivity or automation performance. BERGQUIST Gap Filler TGF 1500RW delivers these three valuable benefits in a single material, extending even greater process flexibility and post-assembly adaptability.

Henkel’s new TIM is a one-part, cure-in-place liquid gap filler allowing use with automated dispensing equipment for high-volume manufacturing operations. Because the material is applied as a liquid, it is ideal for miniaturized, high-density assemblies and complex architectures, penetrating small gaps for complete coverage. Once cured, the material provides optimized surface contact and thermal transfer with a 1.5 W/m-K thermal conductivity, and also delivers excellent low and high temperature mechanical and chemical stability.

“In addition to its high throughput and thermal control capabilities, what makes BERGQUIST Gap Filler TGF 1500RW distinctive among other liquid thermal interface materials is its peelability,” explains Doug Dixon, Henkel Adhesive Electronics Global Marketing Director. “Traditional cure-in-place TIMs generally require very high force for disassembly, which often results in permanent damage to components and substrates. The new BERGQUIST TIM, however, peels away cleanly from contact surfaces to safeguard delicate componentry and preserve product value.”

Supply chain simplification is another advantage of BERGQUIST Gap Filler TGF 1500RW. Notably, the material facilitates infinite thickness variations and accommodates multiple dimensions, allowing a single material to be used for many products and applications across the manufacturing operation. Conversely, TIMs in pad or film formats are supplied in pre-determined die cut shapes and thickness, with each requiring its own part number. Simplification of inventory complexity adds to cost-efficiency and optimized resource utilization.

“As today’s manufacturers must compete in demanding and dynamic environments where product performance, operational efficiency and profitability are equally prioritized,” says Dixon in summary, “materials like BERGQUIST Gap Filler TGR 1500RW that deliver thermal transfer performance, enable high volume production, streamline the supply chain and preserve assembly value help assembly specialists achieve their business objectives.”

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