Discover the brands from our business units Henkel Adhesive Technologies and Consumer Brands.
Sep 17, 2019 Irvine, CA
Henkel’s presence at the upcoming IMAPS symposium, taking place September 30 – October 3 in Boston, MA, will center on its high reliability know-how at the wafer and board level, with particular emphasis on the company’s solutions for aerospace electronics. As miniaturization and expanded function are impacting the entire electronics ecosystem -- from bare wafers to integrated systems – new materials are required to cope with the effects of increased heat generation, exposure to harsh environments and smaller package dimensions.
Henkel has developed a wide range of advanced formulations to address the challenges of today’s electronic realities. At IMAPS 2019, expert Henkel team members will deliver informative presentations on emerging technologies and will be available in the booth 408 to discuss several of the company’s enabling products, including:
While advanced, capable materials are essential, practical knowledge and expertise about their selection, use and integration are the linchpins to success. Henkel materials and process thought leaders share their know-how during several educational sessions throughout the IMAPS event. Top materials scientists from Henkel will present on topics including thermal management techniques using thermal interface materials; advanced assembly materials for heterogeneous integration and 3D packaging; electrically conductive film adhesives for high temperature compatibility and high reliability performance; and, innovative solder alloys for demanding automotive applications. Details for these courses and presentations can be found on imaps.org/imaps2019.
The Henkel team invites all show delegates to connect with its technical experts in IMAPS booth 408 to learn more or discuss specific technology requirements in greater detail. For information about Henkel’s high-reliability materials and application expertise, visit henkel.com/electronics.
*As per June 2018 REACH SVHC documentation.