Henkel Innovation Strength Rewarded;
Two Leading-Edge Products Land High Honors

Low-pressure, thin bond line phase change thermal interface material and UL safety agency-rated conformal coating earn top spots in Circuits Assembly NPI Award program

Adhesive Technologies Industrial Adhesives Innovation Apr 18, 2024
Low-pressure, thin bond line phase change thermal interface material and UL safety agency-rated conformal coating earn top spots in Circuits Assembly NPI Award program

Henkel announced that two of its latest electronic material innovations were named best-in-class in Circuits Assembly magazine’s NPI Award program, which recognizes leading new products launched in the last year. Henkel’s Bergquist® Hi Flow THF 5000UT phase change formulation won in the Thermal Interface Materials (TIMs) category, and its Loctite® Stycast CC 8555 conformal coating came in first among Coatings/Encapsulants entrants.

Bergquist® Hi Flow THF 5000UT is a thin bond line phase change TIM film that delivers low thermal impedance at market-leading low pressure, effectively balancing the device requirements for excellent thermal control and low stress in high-end electronics applications. The formulation ensures thorough wet-out for efficient heat dissipation while limiting mechanical pressure on large, multi-chip packages like those used for AI, high-performance computing, and industrial applications. Today’s most powerful AI and HPC processors integrate sizeable, thin, delicate die. Space is limited, power density is high, and controlling heat without damaging the device is a necessity. Bergquist® Hi Flow THF 5000UT addresses all these demanding conditions, helping to boost operational performance.

Joining the company’s TIM in the winner’s circle, Henkel’s Loctite® Stycast CC 8555 conformal coating also earned an NPI Award based on its proven ability to protect high-power electronics in extreme environments, confirmed by its UL temperature and flammability certification credentials. With a relative temperature index (RTI) rating of 130° C per the UL 746-E standard and a UL 94 V0 flammability rating, Loctite® Stycast CC 8555 protects printed circuit boards (PCBs) and sensitive components against moisture, mixed gases, and chemicals that can cause corrosion and damage. These attributes help secure long-term reliability in demanding industrial and outdoor environments, while the material’s VOC-free, solvent-free formulation provides health, safety, and cost-of-ownership benefits.

“Winning two NPI Awards in such diverse categories underscores Henkel’s innovation breadth,” says George Thomas, Americas Senior Vice President of Henkel Adhesive Technologies’ Industrial business unit. “Both materials address electronic reliability requirements for some of the toughest applications in the most extreme environments. We are grateful that the NPI Award judges recognized the impact these products will have in enabling new technology development.”

Circuits Assembly Publisher Mike Buetow notes Henkel’s impressive NPI Award history, saying, “Over the past decade, Henkel products entered in the NPI Award contest have consistently won in their respective categories, underscoring the judges’ recognition of the company’s alignment with current and future market needs. Congratulations on these latest wins!”

Commercialized in early 2024, this is Loctite® Stycast CC 8555’s first industry award. Bergquist® Hi Flow THF 5000UT made its market debut in mid-2023 and has since earned three notable distinctions. The material won a Global Technology Award, was named a Lightwave Innovation Review honoree, and has now secured an NPI Award.

Learn more about Henkel’s thermal interface and protection materials portfolios by visiting

Related Feature

A man in a lab coat with Henkel logo standing in a lab next to a microscope

Anyone who successfully manages brands over generations needs the right balance of tradition and innovation. By understanding change, we can shape the future. This is also reflected in Henkel's corporate purpose: “Pioneers at heart for the good of generations”.