At this year’s IPC APEX Expo, taking place January 29 – 31 in San Diego, CA, Henkel Corporation will debut several new materials featured as part of six different display and demo areas within booth #907. Highlighting the breadth of its portfolio and the company’s ability to deliver complete material sets for demanding applications, Henkel’s Solutions Across the Board exhibit allows show delegates to see materials in action and discuss specific requirements with the knowledgeable Henkel technical team.
At Henkel’s booth, visitors can learn more about:
Jan 21, 2019 Irvine, CA
New Interconnect, Thermal and Protection Materials from Henkel on Display at IPC APEX Expo 2019
- New LOCTITE® solder materials and fluxes for high-reliability automotive applications, as well as temperature-stable LOCTITE GC formulations for low-voiding on QFNs and LGAs and jetting for ultra fine-pitch architectures and flexible substrates.
- Low pressure molding TECHNOMELT® to facilitate automated masking of keep out zones prior to conformal coating processes and to provide a simple, three-step, potting alternative for electronic device encapsulation. Live molding demonstrations will take place throughout the show in booth #907.
- BERGQUIST® thermal control solutions in liquid and pad formats ensure effective heat dissipation for increased reliability. The newest product in Henkel’s TIM portfolio, BERGQUIST GAP PAD® TGP 7000ULM, delivers the unique properties of ultra-low assembly stress and high thermal conductivity (7.0 W/m-K) and is ideal for today’s Telecom, Power, Automotive and Consumer applications.
- PCB Protection from a wide range of solvent-free conformal coatings, which safeguard printed circuit boards from thermal shock, moisture, corrosive liquids and other adverse environmental conditions.
- High-temp compatible device protection with LOCTITE® ECCOBOND® UF 1173 underfill, which combines a high Tg (160°C) with a solder-like low CTE for maximum protection in extreme conditions. The material, which is one of only five products selected for an IPC APEX Expo Innovation Award, also complies with current REACH substances of very high concern (SVHC) guidelines and contains no reportable carcinogenic, mutagenic or toxic for reproduction substances (CMRs).
- Structural adhesives, inks and electrically conductive adhesives that enable modern designs for wearables, streamlined medical devices and in-cabin automotive comfort and functionality.
- Novel EMI conformal shielding materials offer a thin, streamlined replacement for conventional and cumbersome RF isolation approaches. See a live EMI spray coating demonstration in Asymtek booth #2125.
As part of IPC APEX Expo’s technical conference, key members of Henkel’s expert team will share their materials and process knowledge during three paper presentations:
- Thermal materials specialist and Principal Scientist, John Timmerman, Ph.D., will present his work entitled “The Effects of Filler Morphology on the Fracture Toughness of Thermally Conductive Adhesives” on Wednesday, January 30th at 10:30 a.m.
- Addressing advances in medical devices and the materials used to facilitate smaller, smarter designs, Senior Technical Service Engineer, Jeffrey Grover, shares details on medical sensor manufacturing in his paper “Printed Electronics for Medical Devices” on Wednesday, January 30th at 3:30 p.m.
- As part of its collaborative work with supplier partners, Henkel’s development efforts in the area of package-level EMI shielding will be discussed during the “Dispensing EMI Shielding Materials: An Alternative to Sputtering” presentation delivered by Asymtek’s Garrett Wong on Tuesday, January 20th at 1:30 p.m.
IPC APEX Expo show delegates are invited to learn more about specific Henkel solutions by visiting the team in booth #907 throughout the three-day event. Additional details about Henkel’s full portfolio of advanced electronic materials are available by visiting henkel-adhesives.com/electronics.
